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Parameter 1 : Material: AlN/BeO
Parameter 2 : Accuracy: line width/line spacing accuracy ±5um
Parameter 3 : Metalization: Ti, Cu, Ni, Pt, Au, prefabricated AuSn film, etc

Product Detail

Power heat sink
I. Overview
Using semiconductor thin film vacuum evaporation, sputtering, electroplating, photolithography, scribing and other processes, pattern photolithography, copper thickening, and prefabricated gold tin film preparation are performed on the surface of high thermal conductivity ceramic substrates to produce heat dissipation, electrical connection and other functions. The base substrate for high-power lasers.

2. Product features
High thermal conductivity, high precision

3. Technical indicators
Material: AlN/BeO
Accuracy: line width/line spacing accuracy ±5um;

Metalization: Ti, Cu, Ni, Pt, Au, prefabricated AuSn film, etc.; meet the requirements of gold wire bonding, AuSn welding, conductive adhesive bonding.

4. Application areas

High-power lasers, semiconductor refrigerators, power circuits and other fields. (Can add application photos in PPT)

5. Typical product pictures

Tags : thin film AlN/BeO Power heat sink Power heat sink thin film line width accuracy ±5um thin film Power heat sink

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