Heat spreading vapor chamber for CPU

Sales Heat spreading vapor chamber for CPU

Like heat pipes, vapor chamber thermal conductivity increases with length. This means that a vapor chamber the same size as the heat source will offer little advantage over a solid piece of copper. A good rule of thumb says that the area of the vapor chamber should be equal to or greater than 10X the area of the heat source.  In situations where the thermal budget is large or when a lot of airflow drives a small fin stack this may not be an issue. However, it’s often the case that the base of the sink needs to be considerably larger than the heat source.

Product Detail  

Heat Spreading Vapor Chamber for CPU

Product Details:

Item: vapor chamber 

Material: stainless steel

Size: customized

Thickness: 0.05-1.0mm

Color: black or customized, plating silver, gold, nickle or others are available

Logo: available

Mold harge: usd100

Sample lead time: 2-7 days

Daily capacity:100,000pcs per day

Etching Process: drawing files, material cutting, cleaning, photo resist coating, exposure, developing, inspection, etching, stripping, packing


Advantage: 

1, Made by photo etching process, high precision, can be ±0.01mm.

2, Can be any designs, no matter how complicated, it will not increase the cost.

3, Flat and smooth surface, no burr, stress free.

4, Tiny holes are available, such as 0.1mm diameter.

5, Short lead time, sample can be finished in 2days, high producing capacity, 100000pcs per day.


Other Products:

Vapor chamber, speaker grill, shim, lead frame, encoder disc, thin metal parts, rotary candle holder, bookmark, brass ornament, Christmas hanging ornament, metal card, etched stencil, ect


Applications & Usage:

Our copper vapor chamber is widely used in cell phone and lap notebook computer.


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